A modeling approach for power integrity simulation in 3D-IC designs
This article outlines an approach for concurrent analysis of the 3D-IC power grid, as well as a chip model-based analysis, and how analysis based on a chip macro-model can yield the same results as concurrent full-chip analysis, resulting in significant runtime benefits.
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Tags: power grid
Achronix chairman: Intel foundry gambit poised for payoff
Achronix chairman: Intel foundry gambit poised for payoff
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Tags: Intel foundry gambit
TSMC raises capex to record $8.5 billion, pulls in 20-nm
TSMC raises capex to record $8.5 billion, pulls in 20-nm
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Chip execs see 20 nm variants, 3-D ICs ahead
Chip execs see 20 nm variants, 3-D ICs ahead
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Tags: Chip execs
MIPS Technologies Reports Third Quarter Fiscal 2012 Financial Results
MIPS Technologies Reports Third Quarter Fiscal 2012 Financial Results
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Tags: MIPS Technologies Reports Third Quarter Fiscal, Financial Results, mips technologies
Cosmic Circuits attains ISO 9001:2008 certification
Cosmic Circuits attains ISO 9001:2008 certification
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Tags: Cosmic Circuits
Intrinsic-ID enables Secure Boot Software Authentication on New VoIP Processor of Dialog Semiconductor
Intrinsic-ID enables Secure Boot Software Authentication on New VoIP Processor of Dialog Semiconductor
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Tags: Dialog Semiconductor View, Secure Boot Software Authentication
64 State 4x8PSK (4D 8PSK) CCSDS ECSS Viterbi Decoder
64 State 4x8PSK (4D 8PSK) CCSDS ECSS Viterbi Decoder
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IEEE 802.11n/IEEE802.11ac (WiFi) LDPC Decoder
IEEE 802.11n/IEEE802.11ac (WiFi) LDPC Decoder
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HD Wireless Analog Front End in TSMC 65nm LP
HD Wireless Analog Front End in TSMC 65nm LP
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